Gary M. Gladysz, Krishan K. Chawla

Voids in Materials

From Unavoidable Defects to Designed Cellular Materials. 2. Auflage. Sprachen: Englisch
eBook (epub), 338 Seiten
EAN 9780128192832
Veröffentlicht November 2020
Verlag/Hersteller Elsevier Science & Techn.

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Beschreibung

All materials have voids in them, at some scale. Sometimes the voids are ignored, sometimes they are taken into account, and other times they are the focal point of the research. Voids in Materials: From Unavoidable Defects to Designed Cellular Materials takes due notice of all these occurrences, whether designed or unavoidable defects. We define, categorize, and characterize the voids (or empty spaces in materials) and we analyze the effects they have on material properties.This second edition is an updated and expanded central reference for voids in materials and covers all types of voids, intrinsic and intentional, and stochastic and nonstochastic, and the processes and conditions that are needed to create them and is a valuable resource to students in the areas of mechanical engineering, chemical engineering, materials science and engineering, physics, and chemistry, as well as scientists, researchers, and engineers in industry.
- the effect of voids in materials; from low volume fraction defects and free volume in polymer networks to high void volume fraction foams and aerogels- how and why voids are introduced into materials across the length scales- biomaterial design used in vivo for soft, hard, and nerve tissue scaffolds- metallic and geopolymeric foams- additive manufacturing technologies used to tailor regularity (R) in the cell structure- stochastic, nonstochastic, and Voronoi foams- the latest techniques for characterizing voids- new chapters, covering the Kirkendall effect to create hollow and porous structures, and nanometer scale voids: nanotubes, zeolites, organic frameworks, and nanoporous noble metals

Portrait

Gary Gladysz is an adjunct associate professor of materialsscience and engineering at the University of Alabama atBirmingham, United States and founder at X-Link 3D. Hereceived his PhD from the New Mexico Institute of Miningand Technology, where he participated in the NATOCollaborative Program with the German Aerospace Institute(DLR). Since receiving his PhD, he has led research efforts inuniversity, government, and industrial settings. He has extensiveresearch experience designing and characterizing thermosetcomposite materials for 3D printing, fibrous composites, ceramic composites,polymers, composite foams, and thin films. As a technical staff member at LosAlamos National Laboratory (LANL), he was technical lead for rigid composites andthermoset materials. In 2005 he was awarded the LANL Distinguished PerformanceGroup Award for his work leading materials development on the ReliableReplacement Warhead Feasibility Project. Additionally, while the US Army, he developedcomposite materials and test protocols for ballistic head protection. He hasserved on funding review boards for LANL, National Science Foundation, ACS, andthe Lindbergh Foundation. He has been guest editor on many issues of leadingmaterials science journals, including Journal of Materials Science and MaterialsScience & Engineering. He has organized many international conferences/symposiaon syntactic foams, composite materials, and innovative materials for additivemanufacturing. He started and chairs the ECI international conference series onSyntactic and Composites Foams. He currently lives in Boston, Massachusetts,United States.Professor Krishan Chawla obtained his BS from Banaras Hindu University and his MS and PhD degrees from theUniversity of Illinois at Urbana-Champaign, United States. Hehas taught and/or done research at (in alphabetical order)Arizona State University, Tempe, AZ (United States); EcolePolytechnique Federale de Lausanne (Switzerland); FederalInstitute for Materials Research and Testing (BAM), Berlin(Germany); German Aerospace Research Institute (DLR),Cologne (Germany); Instituto Militar de Engenharia (Brazil);Laval University (Canada); Los Alamos National Lab (UnitedStates); New Mexico Tech (United States); Northwestern University (United States);University of Alabama at Birmingham (United States); and University of Illinois atUrbana-Champaign (United States).He has published extensively in the areas of processing, microstructure, andmechanical behavior of materials, in general, and composite materials and fibers, inparticular. Besides being a member of various professional societies, he is Editor ofInternational Materials Review (published jointly by ASM International, UnitedStates and the Institute of Materials, London) and a member of the Editorial Boardof various journals. During 1989-1990, he served as a Program Director for metalsand ceramics in the Division of Materials Research, National Science Foundation,Washington, DC, United States. He serves as a consultant to the industry, USnational laboratories, and various US federal government agencies. In 1992 he wasthe recipient of the Eshbach Society Distinguished Visiting Scholar Award fromNorthwestern University. During the period of June, 1994 through June, 1995 heheld the US Dept. of Energy Faculty Fellowship at Oak Ridge National Lab. In 1996he was given the Distinguished Researcher Award by the New Mexico Tech. In 1997he was made a Fellow of ASM international. In 2000 he was awarded theDistinguished Alumnus award by Banaras Hindu University. He received thePresident's Award for Excellence in Teaching, University of Alabama at Birminghamin 2006. In 2018 he was awarded the Albert Nelson Marquis Lifetime AchievementAward.

Inhaltsverzeichnis

1. Introduction2. Intrinsic voids in crystalline materials: Ideal materials and real materials3. Intrinsic voids in polymeric networks4. Nanometer scale porous structure5. Hollow and porous structures utilizing the Kirkendall effect6. Techniques for introducing intentional voids into materials7. Techniques of introducing intentional voids into particles and fibers8. Void characterization techniques9. Characteristics and properties of porous materials10. Applications

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