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Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.
1. An Overview of Electronic Devices and Their Reliability 2. Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated 3. Defects, Contamination and Yield 4. The Mathematics of Failure and Reliability 5. Mass Transport-Induced Failure 6. Electronic Charge-Induced Damage 7. Environmental Damage to Electronic Products 8. Packaging Materials, Processes, and Stresses 9. Degradation of Contacts and Packages 10. Degradation and Failure of Electro-Optical and Magnetic Materials and Devices 11. Characterization and Failure Analysis of Material, Devices and Packages 12. Future Directions and Reliability Issues
