Technologies Enabling Future Mobile Connectivity & Sensing

This book provides an overview of the latest research results in RF and digital SOI technology development for 5 and 6G, device and substrate characterization, packaging technology, and the realization of full systems including power amplifiers, linearization techniques, beamforming transceivers, access points, and radar detection.

François Brunier graduated as physics and electronics Engineer from Centrale-Supelec in 1997. From 1998 to 2002, he worked as device integration engineer for embedded DRAM products in STMicroelectronics Crolles. In 2002, he joined Soitec as head of advanced characterization laboratory. From 2009 to 2011, as a product manager, he led the RF-SOI and power SOI product development and offering. Since 2012, as a partnership program manager, he is in charge of European collaborative KDT programs, IPCEI and public relations. Björn Debaillie leads imec's collaborative R&D program on cutting-edge IoT technologies, covering high speed communications, high resolution sensing, and neuromorphic computing. As a seasoned researcher & manager, he is responsible for strategic collaborations and partnerships, innovation management, and public funding policies as well as the operational management and coordination across imec's collaborative programs and projects. Björn Debaillie coordinates public funded projects and seeds new initiatives. He holds patents, received awards and authored books and international papers published in various journals and conference proceedings. Dominique Morche received the M.Sc. degree in engineering from the Ecole Nationale Supérieure d'Electricité et de Radioelectricité de Bordeaux, Bordeaux, France, in 1990, and the Ph.D. degree in electronics from the Institut National Polytechnique de Grenoble, Grenoble, France, in 1994. His Ph.D. mainly focuses on sigma-delta AnalogTo-Digital Converter (ADC). From 1994 to 2001, he was with France Telecom, Meylan, France, as a Research Engineer. He has been involved in the architecture and design of analog circuits for telecom applications. He is currently with the Commissariat à l'énergie Atomique-Leti Minatec, Grenoble, where he is a Research Director. His current field of research is in the specification and design of RF architecture for UWB, mmwave, and the IoT systems. Erkan Isa is with Fraunhofer EMFT since April'13, founding the IC Design group at this center. He holds PhD'12 in Microelectronics from EPFL, MS'06 in Microelectronics from TU Hamburg-Harburg, BS'05 in Computer Engineering from Istanbul Technical University (ITU), and BS'03 in Electronics and Comm. Eng. from ITU. From 2007 to 2010 he was with CEA-LETI, Grenoble, France, working on the design and optimization of A/D converters in deep sub-micron technologies. Between 2010 and 2013 he worked for Fujitsu Semiconductor Europe GmbH in Munich as an analog and mixed-signal design engineer, contributing to the key mixed-signal IPs for automotive SoC products. Dr. Isa serves as Group Manager and have been coordinating collaborative programs for Fraunhofer, e.g. SERENE-IoT (PENTA), THINGS2DO (ENIAC), ADMONT (ECSEL), WAYTOGO FAST (ECSEL), REFERENCE (ECSEL), OCEAN12 (ECSEL), BEYOND5 (ECSEL). Dr. Isa had served as Technical Program Chair and General Co-Chair for IEEE NEWCAS 2018 and NEWCAS 2019, respectively. Jan Craninckx obtained his Ph.D. degree in microelectronics from the KULeuven in 1997 and was with Alcatel Microelectronics as a senior RF engineer until 2002. He then joined IMEC (Leuven, Belgium), where he currently is IMEC fellow for RF, mmwave, analog and mixed signal circuit design. Dr. Craninckx has authored and co-authored more than 200 papers, book chapters and patents, was Editor-in-Chief of the IEEE JSSC, and is an IEEE fellow.

1. RF Technology Roadmap for 5G and 6G RF Front End Systems 2. From Beyond 5G to Sub-THz Era 3. A Low Power 5G Access Point Targeting Airplane Cabin Connectivity 4. Digital Beamforming Transceiver Design in 22 nm FD-SOI Technology for 39 GHz 5G Access 5. Disruptive TRX Design for D-band 6. Packaging Technologies and Challenges Towards 5G Integration of mm-wave Components and Silicon ICs 7. Energy Efficient Beam Control for 5G Antennas 8. Recent Progress on SOI CMOS Power Amplifiers for Mobile and WiFi Applications 9. V2X RF Front End Module Assistance Circuits: Observation Receiver, DPD, and Supply Modulator 10. Impact of High-resistivity Substrate on RF and mm-wave Performance of 22 nm FD-SOI Devices and Circuits 11. Detection of Human Targets Using a MIMO FMCW Radar with Slow-time DC-value Suppression Appendix 1. Some Visions Towards 6G Cellular Systems Appendix 2. 6G Communications and Localization: An Overview of Technologies Opportunities and Challenges Appendix 3. Heterogeneous Integration for Complex mm-wave Transceivers Appendix 4. D-Band Noise Characterization and Modelling in Advanced FDSOI Devices