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Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve "short line distances of the cm-mm order" and "large line counts of hundreds-thousands." This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.
1. Introduction 2. Guidelines toward Self-Organized 3D Integrated Optical Interconnects 3. Scalable Film Optical Link Modules (S-FOLMs) 4. Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits 5. Resource Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT 6. High-Speed/Small-Size Light Modulators and Optical Switches 7. Self-Organized Lightwave Networks (SOLNETs) 8. Self-Organized 3D Integrated Optical Interconnects: Model Proposals 9. Self-Organized 3D Micro Optical Switching Systems (3D-MOSS): Model Proposals and Predicted Performance 10. Film-Based Integrated Solar Energy Conversion Systems 11. Embodiments Disclosed in Patents 12. Future Challenges
